Electrocatalytic parameters of the electrodeposition of copper with silicotungstic acid (STA)

被引：12

作者：

Fricoteaux, P

Savadogo, O

机构：

[1] Ecole Polytech, Lab Electrochim & Mat Energet, Montreal, PQ H3C 3A7, Canada

[2] Univ Reims, DTI, Lab Electrochim & Chim Solide, CNRS EP 120, F-51687 Reims, France

来源：

ELECTROCHIMICA ACTA | 1999年 / 44卷 / 17期

关键词：

D O I：

10.1016/S0013-4686(99)00008-0

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The effect of silicotungstic acid (STA) on the electrodeposition of copper in sulphuric acid was investigated. It was shown that the effect of STA on the kinetic parameters of electrodeposition depends on the electrodeposition overpotential. In particular, the effect of STA on the potential region where the reversible electrodeposition occurred was determined. The variation of the electrodeposition efficiency with the electrodeposition overpotential was deduced. These various results are correlated to the chemical composition of the electrodeposits. (C) 1999 Elsevier Science Ltd. All rights reserved.

引用

页码：2927 / 2940

页数：14

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