The first very low-IF RX, 2-point modulation TX CMOS system on chip Bluetooth solution

被引：7

作者：

Dürdodt, C ^{[1
]}

Friedrich, M ^{[1
]}

Grewing, C ^{[1
]}

Hammes, M ^{[1
]}

Hanke, A ^{[1
]}

Heinen, S ^{[1
]}

Oehm, J ^{[1
]}

Pham-Stäbner, D ^{[1
]}

Seippel, D ^{[1
]}

Theil, D ^{[1
]}

van Waasen, S ^{[1
]}

Wagner, E ^{[1
]}

机构：

[1] Infineon Technol AG, Design Ctr, Dusseldorf, Germany

来源：

2001 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS | 2001年

关键词：

D O I：

10.1109/RFIC.2001.935651

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The proposed low cost Bluetooth single-chip solution is implemented in a 0.25 mum CMOS technology. The "System On Chip (SOC)" includes all necessary baseband- and RF-parts to achieve full Bluetooth functionality, by occupying 18.5mm(2) chip area in total, The maximum current consumption of the analog part is 60mA. The internal regulated supply voltages of the analog and digital parts are 2.65V. First measurement results of basic functionalities are discussed in this paper.

引用

页码：99 / 102

页数：4