Effect of mold resin on reliability in gold-aluminum bonding

被引：9

作者：

Imasato, E ^{[1
]}

Araki, M ^{[1
]}

Shimizu, I ^{[1
]}

Ohno, Y ^{[1
]}

机构：

[1] Kumamoto Univ, Fac Engn, Dept Mat Sci, Kumamoto 860, Japan

来源：

2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/EPTC.1998.756026

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Gold-aluminum wire bonds in LSI is drastically degraded by corrosion of Au-Al intermetallic compound. This corrosion is due to bromine gas that is emitted when an encapsulant resin is exposed to a high temperature. In this study, temperature dependence on this bond degradation was investigated. Degradation starting times of Au-Al compounds as a function of annealing temperatures ranging from 180 to 280C were studied. The higher annealing temperature was, the faster shear strength was degraded. Activation energy of this degradation behavior was calculated 110KJ/mol, which was similar to that of Au-Al intermetallic layer growth. It was found that intermetallic compounds formed within Au-Al bond by high temperature annealing were corroded by bromine gas at room temperature.

引用

页码：338 / 344

页数：7

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