Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

被引：28

作者：

Jiang, LN ^{[1
]}

Koo, JM ^{[1
]}

Zeng, SL ^{[1
]}

Mikkelsen, JC ^{[1
]}

Zhang, L ^{[1
]}

Zhou, P ^{[1
]}

Santiago, JG ^{[1
]}

Kenny, TW ^{[1
]}

Goodson, KE ^{[1
]}

Maveety, JG ^{[1
]}

Tran, QA ^{[1
]}

机构：

[1] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA

来源：

SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001 | 2001年

关键词：

elelectrokinetic pump; microchannel heat sinks; two-phase heat transfer; IC cooling technology;

D O I：

10.1109/STHERM.2001.915168

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm x 1.2 cm silicon thermal test chip under an open-loop operation with a water flowrate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the operating pressure of the working fluid are expected to lower the resistance below 0.25 K/W.

引用

页码：153 / 157

页数：5

共 8 条

[1]

HIGH-FLUX BOILING IN LOW-FLOW RATE, LOW-PRESSURE DROP MINI-CHANNEL AND MICROCHANNEL HEAT SINKS [J].