Lumped Dynamic Electrothermal Model of IGBT Module of Inverters

被引:62
作者
Batard, Christophe [1 ]
Ginot, Nicolas [1 ]
Antonios, Joe [1 ]
机构
[1] Univ Nantes, Lunam Univ, Inst Elect & Telecommun, Rennes Lab, F-44200 Nantes, France
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2015年 / 5卷 / 03期
关键词
Electrical-thermal cosimulation; heat transfer; multiscale problem; semiconductor devices; thermal models; THERMAL MODELS; SIMULATION;
D O I
10.1109/TCPMT.2015.2392625
中图分类号
T [工业技术];
学科分类号
120111 [工业工程];
摘要
This paper presents a lumped dynamic electrothermal model of an insulated gate bipolar transistor module of inverters. The thermal model consists of a 3-D network of RC cells constructed for time-dependent operation. The network was found to be precise for determining the temperature excursion of diodes and transistors subsequent to time-dependent power losses. Thermal resistances and capacitances accounting for heat spreading and thermal penetration depth effects were introduced. Electrothermal simulations carried out on a 1200 V-300 A module with a time-dependent average power loss were found to be in good agreement with experiments using infrared thermal imaging. This paper focuses on very-low-frequency behavior (less than 1 Hz) at a switching frequency of 10 kHz.
引用
收藏
页码:355 / 364
页数:10
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