Metal films on polymer substrates stretched beyond 50%

被引:348
作者
Lu, Nanshu [1 ]
Wang, Xi [1 ]
Suo, Zhigang [1 ]
Vlassak, Joost [1 ]
机构
[1] Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.2817234
中图分类号
O59 [应用物理学];
学科分类号
摘要
When a freestanding plastically deformable metal film is stretched, it ruptures by strain localization, and the elongation is less than a few percent. When the film is deposited on a polymer substrate, however, strain localization may be retarded by the substrate. This paper reports Cu films deposited on Kapton substrates and stretched up to the rupture of the substrates (at an elongation between 50% and 60%). When Cr adhesion layers are introduced between Cu and Kapton, few microcracks in Cu may be found, and the measured electrical resistance agrees with a theoretical prediction. Micrographs show that the strain localization and debonding coevolve. (C) 2007 American Institute of Physics.
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页数:3
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共 23 条
[1]   On the interface debond at the edge of a thin film on a thick substrate [J].
Alaca, BE ;
Saif, MTA ;
Sehitoglu, H .
ACTA MATERIALIA, 2002, 50 (05) :1197-1209
[2]   A woven inverter circuit for e-textile applications [J].
Bonderover, E ;
Wagner, S .
IEEE ELECTRON DEVICE LETTERS, 2004, 25 (05) :295-297
[3]   Organic photovoltaics: technology and market [J].
Brabec, CJ .
SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2004, 83 (2-3) :273-292
[4]   FRACTURE OF METAL-POLYMER LINE STRUCTURES .1. SEMIFLEXIBLE POLYIMIDE [J].
CHIU, SL ;
LEU, J ;
HO, PS .
JOURNAL OF APPLIED PHYSICS, 1994, 76 (09) :5136-5142
[5]   A methodology for determining mechanical properties of freestanding thin films and MEMS materials [J].
Espinosa, HD ;
Prorok, BC ;
Fischer, M .
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2003, 51 (01) :47-67
[6]   The path to ubiquitous and low-cost organic electronic appliances on plastic [J].
Forrest, SR .
NATURE, 2004, 428 (6986) :911-918
[7]  
GRUBER P, 2003, MRS S P
[8]   Deformation behavior of thin copper films on deformable substrates [J].
Hommel, M ;
Kraft, O .
ACTA MATERIALIA, 2001, 49 (19) :3935-3947
[9]   Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers [J].
Huang, HB ;
Spaepen, F .
ACTA MATERIALIA, 2000, 48 (12) :3261-3269
[10]  
Kang Y.S., 1996, THESIS U TEXAS AUSTI