Enhancement of the wettability and solder joint reliability at the Sn-9Zn0.5Ag lead-free solder alloy-Cu interface by Ag precoating

被引：29

作者：

Chang, TC

Hsu, YT

Hon, MH

Wang, MC

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

[2] Natl Kaohsiung Univ, Dept Mech Engn, Kaohsiung 80782, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2003年 / 360卷 / 1-2期

关键词：

wettability solder joint reliability; Ag precoating; intermetallic compound; diffusion coefficient;

D O I：

10.1016/S0925-8388(03)00300-1

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag solder alloy-Cu interface by Ag precoating has been investigated. The wettability of the Sn-9Zn-0.5Ag solder alloy-Cu interface has been improved by Ag precoating. The adhesion strength of the solder alloy-Ag precoated Cu interface increases from 4.11+/-0.56 to 6.92+/-0.85 MPa as dipped at 250 degreesC for 10 s. When the dipping time is prolonged from 10 to 30 s, the interfacial adhesion strength increases from 6.92+/-0.85 to 13.62+/-0.73 MPa. The interfacial adhesion strength is enhanced by the rod-like Cu-Zn intermetallic compound (IMC) formed close to the interface. The 2 diffusion coefficients of Sn and Zn in the IMC layer are determined as 5.76x10(-10) and 9.50x10(-11) cm(2)/s at the Sn-9Zn-0.5Ag-Cu and Sn-9Zn-0.5Ag-Ag precoated Cu interfaces, respectively. (C) 2003 Elsevier B.V. All rights reserved.

引用

页码：217 / 224

页数：8