Microelectromechanical filters for signal processing

被引:202
作者
Lin, LW [1 ]
Howe, RT
Pisano, AP
机构
[1] Univ Michigan, Dept Mech Engn & Appl Mech, Ann Arbor, MI 48109 USA
[2] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[3] Univ Calif Berkeley, Dept Engn Mech, Berkeley, CA 94720 USA
基金
美国国家科学基金会;
关键词
coupling springs; microelectromechanical filters; resonators; vacuum encapsulation;
D O I
10.1109/84.709645
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Microelectromechanical filters based on coupled lateral microresonators are demonstrated. This new class of microelectromechanical systems (MEMS) has potential signal-processing applications for filters which require narrow bandwidth (high Q), good signal-to-noise ratio, and stable temperature and aging characteristics. Microfilters presented in this paper are made by surface-micromachining technologies and tested by using an off-chip modulation technique, The frequency range of these filters is from approximately 5 kHz to on the order of 1 MHz for polysilicon microstructures with suspension beams having a 2-mu m-square cross section. A series-coupled resonator pair, designed for operation at atmospheric pressure, has a measured center frequency of 18.7 kHz and a pass bandwidth of 1.2 kHz. A planar hermetic sealing process has been developed to enable high-quality factors for these mechanical filters and make possible wafer-level vacuum encapsulations, This process uses a low-stress silicon nitride shell for vacuum sealing, and experimental results show that a measured quality factor of 2200 for comb-shape microresonators can be achieved.
引用
收藏
页码:286 / 294
页数:9
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