Young's modulus, Poisson's ratio and failure properties of tetrahedral amorphous diamond-like carbon for MEMS devices

被引:90
作者
Cho, S
Chasiotis, I
Friedmann, TA
Sullivan, JP
机构
[1] Univ Virginia, Charlottesville, VA 22904 USA
[2] Univ Illinois, Urbana, IL 61801 USA
[3] Sandia Natl Labs, Albuquerque, NM 87185 USA
关键词
D O I
10.1088/0960-1317/15/4/009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The elastic and failure mechanical properties of hydrogen-free tetrahedral amorphous carbon (ta-C) MEMS structures were investigated via in situ direct and local displacement measurements by a method that integrates atomic force microscopy (AFM) with digital image correlation (DIC). On-chip MEMS-scale specimens were tested via a custom-designed apparatus that was integrated with an AFM to conduct in situ uniaxial tension tests. Specimens 10 mu m and 50 mu m wide and of 1.5 mu m average thickness were used to measure the elastic properties while 340 mu m wide tension specimens with a central elliptical perforation resulting in a stress concentration factor of 27 were tested to investigate local effects on material strength. The Young's modulus, Poisson's ratio and tensile strength were measured as 759 +/- 22 GPa, 0.17 +/- 0.03 and 7.3 +/- 1.2 GPa, respectively. In an effort to understand the effect of local defects and assess the true material strength, the local failure stress at sharp central elliptical notches with a stress concentration factor of 27 was measured to be 11.4 +/- 0.8 GPa. The AFM/DIC method provided for the first time local displacement fields in the vicinity of microscale perforations and these displacement fields were in accordance with those predicted by linear elasticity.
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页码:728 / 735
页数:8
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