Double-bonded InP-InGaAsP vertical coupler 1:8 beam splitter

被引：10

作者：

Raburn, M ^{[1
]}

Liu, B

Abraham, P

Bowers, JE

机构：

[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA

[2] Calicent Networks, Goleta, CA 93117 USA

[3] Agil Commun Inc, Goleta, CA 93117 USA

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 2000年 / 12卷 / 12期

关键词：

beam splitting; optical directional couplers; semiconductor waveguides; wafer bonding; waveguide couplers;

D O I：

10.1109/68.896333

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel three-layer double-bonded InP-InGaAsP waveguide vertical coupler 1:8 beam splitter is demonstrated. The strongly coupled waveguides allow a 583-mum device length, more than 100 times shorter than that of the equivalent horizontal coupler. The device illustrates the use of multiple vertical-layer optical interconnects for three-dimensional routing of optical signals.

引用

页码：1639 / 1641

页数：3

共 10 条

[1]

BLACK A, 1997, IEEE J SEL TOP QUANT, V3, P937

[2]

Heiblum Mordehai, 1975, IEEE J QUANTUM ELECT, VQE-11

[3] SWITCHING OPERATION IN A GAINAS-INP MQW INTEGRATED-TWIN-GUIDE (ITG) OPTICAL SWITCH [J].

KOHTOKU, M ;

BABA, S ;

ARAI, S ;

SUEMATSU, Y .

IEEE PHOTONICS TECHNOLOGY LETTERS, 1991, 3 (03) :225-226

[4] Push-pull fused vertical coupler switch [J].

Liu, B ;

Shakouri, A ;

Abraham, P ;

Bowers, JE .

IEEE PHOTONICS TECHNOLOGY LETTERS, 1999, 11 (06) :662-664

[5] Fused III-V vertical coupler filter with reduced polarisation sensitivity [J].

Liu, B ;

Shakouri, A ;

Abraham, P ;

Chiu, YJ ;

Bowers, JE .

ELECTRONICS LETTERS, 1999, 35 (06) :481-482

[6] NONDESTRUCTIVE PROPAGATION LOSS AND FACET REFLECTANCE MEASUREMENTS OF GAAS/ALGAAS STRIP-LOADED WAVE-GUIDES [J].

PARK, KH ;

KIM, MW ;

BYUN, YT ;

WOO, D ;

KIM, SH ;

CHOI, SS ;

CHUNG, Y ;

CHO, WR ;

PARK, SH ;

KIM, U .

JOURNAL OF APPLIED PHYSICS, 1995, 78 (10) :6318-6320

[7]

*RSOFT INC, 1999, BEAMPR VERS 2 0

[8] Wafer-fused optoelectronics for switching [J].

Shakouri, A ;

Liu, B ;

Kim, BG ;

Abraham, P ;

Jackson, AW ;

Gossard, AC ;

Bowers, JE .

JOURNAL OF LIGHTWAVE TECHNOLOGY, 1998, 16 (12) :2236-2242

[9]

SHAKOURI A, 1999, SPIE CRIT REV, P181

[10] Wafer bonding technology and its applications in optoelectronic devices and materials [J].

Zhu, ZH ;

Ejeckam, FE ;

Qian, Y ;

Zhang, JZ ;

Zhang, ZJ ;

Christenson, GL ;

Lo, YH .

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 1997, 3 (03) :927-936

← 1 →