Advanced deep reactive ion etching:: a versatile tool for microelectromechanical systems

被引：39

作者：

Clerc, PA ^{[1
]}

Dellmann, L ^{[1
]}

Grétillat, F ^{[1
]}

Grétillat, MA ^{[1
]}

Indermühle, PF ^{[1
]}

Jeanneret, S ^{[1
]}

Luginbuhl, P ^{[1
]}

Marxer, C ^{[1
]}

Pfeffer, TL ^{[1
]}

Racine, GA ^{[1
]}

Roth, S ^{[1
]}

Staufer, U ^{[1
]}

Stebler, C ^{[1
]}

Thiébaud, P ^{[1
]}

de Rooij, NF ^{[1
]}

机构：

[1] Univ Neuchatel, Inst Microtechnol, CH-2007 Neuchatel, Switzerland

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1998年 / 8卷 / 04期

关键词：

D O I：

10.1088/0960-1317/8/4/003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Advanced deep reactive ion etching (ADRIE) is a new tool for the fabrication of bulk micromachined devices. Different sensors and actuators which use ADRIE alone or combined with other technologies such as surface micromachining of silicon are presented here. These examples demonstrate the potential and the design freedom of this tool, allowing a large number of different shapes to be patterned and new smart devices to be realized.

引用

页码：272 / 278

页数：7

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