Effect of zinc additions on structure and properties of Sn-Ag eutectic lead-free solder alloy

被引：25

作者：

Kamal, Mustafa ^{[2
]}

Gouda, El Said ^{[1
]}

机构：

[1] Natl Res Ctr, Div Phys, Met Lab, Dept Solid State Phys, Giza, Egypt

[2] Mansoura Univ, Fac Sci, Dept Phys, Met Phys Lab, Mansoura, Egypt

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2008年 / 19卷 / 01期

关键词：

D O I：

10.1007/s10854-007-9289-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of a third element, i.e., Zn in the range of 0.5-2.5 wt.%, on structure and properties of the binary Sn-Ag eutectic lead-free solder alloy were investigated. To identify the structure of the resulting alloys, X-ray diffraction analysis has been carried out. Resistivity, contact angles, Vickers microhardness and Young's modulus have been measured. The results showed that all Zn contents were restricted in formation of Ag-Zn compound indicated by X-ray diffraction peaks, which increased continuously in the number and intensity as Zn content increased. Adding Zn up to 1.5 wt.% improved the wetting and mechanical properties. Above that, wetting angle increased due to the increase in AgZn compound, which may accumulated at the interface between solders and copper- substrate resulting a decrease in the adhesive strength. The alloy of composition Sn-3.5Ag-1.5Zn has the most improved properties between the others.

引用

页码：81 / 84

页数：4