Low frequency drain noise comparison of AlGaN/GaN HEMT's grown on silicon, SiC and sapphire substrates

被引:11
作者
Curutchet, A
Malbert, N
Labat, N
Touboul, A
Gaquière, C
Minko, A
Uren, M
机构
[1] Univ Bordeaux 1, CNRS UMR 5818, ENSEIRB, Lab 1XL, F-33405 Talence, France
[2] IEMN, CNRS UMR 8520, Dept Hyperfrequences & Semicond, F-59652 Villeneuve Dascq, France
[3] Qinetiq Ltd, Malvern WR14 3PS, Worcs, England
关键词
D O I
10.1016/S0026-2714(03)00339-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work deals with the analysis of low frequency drain noise in gallium nitride FETs on silicon, SiC and sapphire substrates. A comparison of the quality in terms of LF noise of these technologies is established. On the basis of the 1/f normalized noise in linear regime, i.e. the alpha(H)/N parameter, GaN HEMT on sapphire and Si substrates have demonstrated as low LF noise level as GaAs based FET's while HEMTs on SiC present a 1/f noise level which is one order of magnitude higher. The analysis of the normalized drain current spectral density vs. the normalized gate voltage Vgn=(Vg-Vt)/\Vt\ has been studied. In particular, for devices on Si substrate, we have pointed out that the evolution of the 1/f noise level strongly depends on the evolution of the gate leakage current. (C) 2003 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1713 / 1718
页数:6
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