A dedicated micromachining technology for high-aspect-ratio millimetre-wave circuits

被引:13
作者
Saint-Etienne, E
Pons, P
Blasquez, G
Temple-Boyer, P
Conedera, V
Dilhan, M
Chauffleur, X
Menini, P
Plana, R
Parra, T
Guillon, B
Lalaurie, JC
机构
[1] CNRS, LAAS, F-31077 Toulouse 4, France
[2] CNES Toulouse, F-31055 Toulouse, France
关键词
dielectric membranes; photoresist mould; micromachining; millimetre-wave passive circuits; low losses;
D O I
10.1016/S0924-4247(98)00073-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a new technological process to implement efficient millimetre-wave passive circuits on a silicon substrate. This process associates a thick positive photoresist acting as a mould for the realization of thick conductors (several microns) with an ultra-thin dielectric membrane using only two layers (SiO(2/)Si(3)N(3,8)) in order to reduce both dielectric and ohmic losses in the coplanar millimetre wave circuits. Coplanar transmission lines and a band-pass filter in the 30 GHz range, featuring respectively transmission losses lower than 0.2 and 1 dB, illustrate some potentialities of this process. (C) 1998 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:435 / 441
页数:7
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