Novel fabrication process of freestanding metallic microstructures using double electroplating

被引:4
作者
Baek, CW [1 ]
Kim, YK [1 ]
机构
[1] Seoul Natl Univ, Sch Elect Engn, Lab Micro Sensors & Actuators, Seoul 151742, South Korea
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1998年 / 37卷 / 12B期
关键词
electroplating; freestanding; 3D sacrificial layer; patterned plating base;
D O I
10.1143/JJAP.37.7104
中图分类号
O59 [应用物理学];
学科分类号
摘要
A simple electroplating surface micromachining process for fabricating freestanding microstructures using UV lithography of thick photoresist and double electroplating is presented. Compared with the conventional surface micromachining process, this process can be used to fabricate various shapes of freestanding "out-of-plane" microstructure. Two different materials electroplated continuously in a single mold are used as a sacrificial and a structural layer, respectively. Shape of the sacrificial layer is determined by changing width and space of the patterned plating base electrodes. The released structure is obtained after selective etching of the sacrificial layer. The shape of released structure is automatically determined by shape of sacrificial layer. The gap and thickness of the structure are easily controlled by electroplating times. Using this process, a simple microactuator with inclined side-support beams is successfully fabricated. This technique can be applied to fabricate a novel type of surface micromachined actuating component.
引用
收藏
页码:7104 / 7109
页数:6
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