Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesives

被引:5
作者
Moon, K
Rockett, C
Kretz, C
Burgoyne, WF
Wong, CP
机构
[1] Georgia Inst Technol, Sch Mat Sci & Engn, NSF Packaging Res Ctr, Atlanta, GA 30332 USA
[2] Air Prod & Chem Inc, Corp Sci & Technol Ctr, Allentown, PA 18195 USA
关键词
conductive adhesive; thermoplastic; epoxy blending; coupling agent; 85 degrees C/85% RH aging test; reworkability;
D O I
10.1163/156856103322538688
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
The adhesion and electrical properties of a PAE-2-based isotropically conductive adhesive (ICA) material were investigated. PAE-2 (thermoplastic polymer)-based ICAs, as well as a commercial epoxy-based ICA, showed dramatic reduction in adhesion to a NiAu surface after the 85degreesC/85% RH aging test, while the adhesion to a SnPb surface did not change much. To improve the adhesion strength of PAE-2 to a Ni:Au surface after the humidity aging test, coupling agents and epoxy blends were used. The formulation with a higher amount of epoxy showed a higher adhesion strength. The combined use of epoxy blending and coupling agents was effective in increasing the adhesion strength of PAE-2 before aging and also in maintaining adhesion at a 50% level after humidity aging. However, its adhesion strength to NiAu was reduced to less than 50% after 85degreesC/95% RH aging. PAE-2-based ICAs showed excellent reworkability.
引用
收藏
页码:1785 / 1799
页数:15
相关论文
共 17 条
[1]   DEVELOPMENT OF AN ANISOTROPIC CONDUCTIVE ADHESIVE FILM (ACAF) FROM EPOXY-RESINS [J].
ASAI, SI ;
SARUTA, U ;
TOBITA, M ;
TAKANO, M ;
MIYASHITA, Y .
JOURNAL OF APPLIED POLYMER SCIENCE, 1995, 56 (07) :769-777
[2]   Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism [J].
Dudek, R ;
Berek, H ;
Fritsch, T ;
Michel, B .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (03) :462-469
[3]   EVALUATION OF CONTACT RESISTANCE FOR ISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVES [J].
GAYNES, MA ;
LEWIS, RH ;
SARAF, RF ;
ROLDAN, JM .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02) :299-304
[4]  
Gilleo K., 1995, Soldering & Surface Mount Technology, P12, DOI 10.1108/eb037885
[5]  
HARRIS PG, 1995, SOLDERING SURFACE MO, V7, P9
[6]   ELECTRICALLY CONDUCTIVE ADHESIVES - A PROSPECTIVE ALTERNATIVE FOR SMD SOLDERING [J].
JAGT, JC ;
BERIS, PJM ;
LIJTEN, GFCM .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02) :292-298
[7]   Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art [J].
Jagt, JC .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (02) :215-225
[8]   Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives [J].
Klosterman, D ;
Li, L ;
Morris, JE .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (01) :23-31
[9]   Development of thermoplastic isotropically conductive adhesive [J].
Liong, S ;
Wong, CP .
51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, :586-592
[10]  
LIONG S, 2002, P 52 IEEE EL COMP TE, P1613