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A Three-Dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture: An Approach for Graphene-Based Thermal Interfacial Materials
被引:293
作者:
Liang, Qizhen
[1
]
Yao, Xuxia
[1
]
Wang, Wei
[1
]
Liu, Yan
[1
]
Wong, Ching Ping
[1
,2
]
机构:
[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
[2] Chinese Univ Hong Kong, Coll Engn, Hong Kong, Hong Kong, Peoples R China
来源:
基金:
美国国家科学基金会;
关键词:
alignment;
anisotropy;
multilayer graphene;
thermal interfacial materials;
assembly;
CARBON NANOTUBE ARRAYS;
CHEMICALLY DERIVED GRAPHENE;
RAMAN-SPECTROSCOPY;
OXIDE;
GRAPHITE;
ELECTRONICS;
FILMS;
CONDUCTIVITY;
CAPILLARITY;
NANOSHEETS;
D O I:
10.1021/nn200181e
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Thermally conductive functionalized multilayer graphene sheets (fMGs) are efficiently aligned in large-scale,by,a vacuum filtration method at room temperature, as evidenced by SEM images and polarized Raman spectroscopy, A remarkably strong anisotropy in properties of aligned fMGs is observed. High electrical (similar to 386 S cm(-1)) and thermal conductivity (similar to 112 W m(-1) K-1 at 25 degrees C) and ultralow coefficient of thermal expansion (similar to-0.71 ppm K-1) In the in-plane direction of A-fMGs. are obtained Without any reduction process. Aligned fMGs are vertically assembled between contacted silicon/silicon surfaces with pure indium as a metallic medium. Thus-constructed three-dimensional-vertically aligned fMG thermal interfacial material (VA-fMG TIM) architecture has significantly higher equivalent thermal conductivity (75.5 W m(-1) K-1) and lower contact thermal resistance (5.1 mm(2) K W-1), compared with their counterpart from A-fMGs that are recumbent between silicon-surfaces.,This finding provides a throughout approach for a graphene-based TIM assembly as well as knowledge of vertically aligned graphene architectures, which may not only facilitate graphene's application in current demanding thermal management but also promote its widespread applications in electrodes of energy storage devices, conductive polymeric composites, etc.
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页码:2392 / 2401
页数:10
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