Bauschinger effect in thin metal films

被引：111

作者：

Xiang, Y ^{[1
]}

Vlassak, JJ ^{[1
]}

机构：

[1] Harvard Univ, Div Engn & Appl Sci, Cambridge, MA 02138 USA

来源：

SCRIPTA MATERIALIA | 2005年 / 53卷 / 02期

基金：

美国国家科学基金会;

关键词：

bauschinger effect; thin films; compression test; plastic deformation; dislocations;

D O I：

10.1016/j.scriptamat.2005.03.048

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The Bauschinger effect in thin sputter-deposited Al and Cu films is studied by isothermally deforming the films alternately in tension and compression. Passivated films exhibit an unusual Bauschinger effect with reverse flow already occurring on unloading, while unpassivated films show little or no reverse flows when the film is fully unloaded. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：177 / 182

页数：6

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