Adhesion strength of poly(imide-siloxane) with Alloy 42 lead frame and silicon dioxide

被引：18

作者：

Kang, JH ^{[1
]}

Cho, K ^{[1
]}

Park, CE ^{[1
]}

机构：

[1] Pohang Univ Sci & Technol, Dept Chem Engn, Polymer Res Inst, Div Elect & Comp Engn, Pohang 790784, South Korea

来源：

POLYMER | 2001年 / 42卷 / 06期

关键词：

poly(imide-siloxane); lead-on-chip packaging; adhesion strength;

D O I：

10.1016/S0032-3861(00)00548-6

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Poly(imide-siloxane) passivation layer was investigated for tapeless lead-on-chip (LOC) packaging. Various molecular weights of siloxane diamine (SDA), alpha,omega-(aminophenoxypropyl)-poly(dimethylsiloxane) were synthesized and incorporated to synthesize poly(imide-siloxane). Effects of molecular weight and content of SDA on the adhesion strength of poly(imide-siloxane) with Alloy 42 lead frame and silicon dioxide were studied. Poly(imide-siloxane) having high molecular weight of SDA showed good adhesion strength with Alloy 42 lead frame. On the other hand, poly(imide-siloxane) having low molecular weight of SDA showed good adhesion strength with silicon dioxide. Therefore, blends of poly(imide-siloxane) having high and low molecular weight of SDA showed good adhesion strength with both Alloy 42 lead frame and silicon dioxide. The origin of different adhesion behavior of poly(imide-siloxane) depending upon the molecular weight of SDA with Alloy 42 lead frame and silicon dioxide was examined by contact angle measurement and X-ray photoelectron spectroscopy (XPS). (C) 2000 Published by Elsevier Science Ltd.

引用

页码：2513 / 2520

页数：8

共 17 条

[1]

*AASTM, 1989, E67388A AASTM, V14, P423

[2] ADHESION OF POLYIMIDES TO METAL AND CERAMIC SURFACES - AN OVERVIEW [J].