Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

被引：100

作者：

Guo, F ^{[1
]}

Lee, J ^{[1
]}

Choi, S ^{[1
]}

Lucas, JP ^{[1
]}

Bieler, TR ^{[1
]}

Subramanian, KN ^{[1
]}

机构：

[1] Michigan State Univ, Dept Mat Sci & Mech, E Lansing, MI 48824 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2001年 / 30卷 / 09期

基金：

美国国家科学基金会;

关键词：

lead-free solder; composite solder; reflow; aging; wettability; microstructure;

D O I：

10.1007/s11664-001-0132-x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Composite solders offer improved properties compared to non-composite solders. Ni reinforced composite solder was prepared by mechanically dispersing 15 vol.% of Ni particles into eutectic Sn-3.5Ag solder paste. The average size of the Ni particle reinforcements was approximately 5 microns. The morphology, size and distribution of the reinforcing phase were characterized metallographically. Solid-state isothermal aging study was performed on small realistic size solder joints to study the formation and growth of the intermetallic (IM) layers at Ni reinforcement/solder and Cu substrate/solder interfaces. Effects of reflow on microstructure and solderability were studied using Cu substrates. Regarding solderability, the wetting angle of multiple reflowed Ni reinforced composite solder was compared to the solder matrix alloy, eutectic Sn-3.5Ag. General findings of this study revealed that Ni particle reinforced composite solder has comparable wetting characteristics to eutectic Sn-3.5Ag solder. Significant IM layers growth was observed in the Ni composite solder joint under isothermal aging at 150 degreesC. Microstructural evolution was insignificant when aging temperature was lower than 100 degreesC. Multiple reflow did not significantly change the microstructure in Ni composite solder joint.

引用

页码：1073 / 1082

页数：10

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