PROCESSING DISPERSION-STRENGTHENED SN-PB SOLDERS TO ACHIEVE MICROSTRUCTURAL REFINEMENT AND STABILITY

被引：23

作者：

BETRABET, HS

MCGEE, SM

MCKINLAY, JK

机构：

[1] Philips Laboratories, Briarcliff Manor

来源：

SCRIPTA METALLURGICA ET MATERIALIA | 1991年 / 25卷 / 10期

关键词：

D O I：

10.1016/0956-716X(91)90023-T

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：2323 / 2328

页数：6

共 37 条

[1]

ASHBY MF, 1969, T METALL SOC AIME, V245, P413

[2]

ASHBY MF, 1980, RECRYSTALLIZATION GR, P325

[3]

BENJAMIN JS, 1970, METALL TRANS, V1, P2943

[4] MICROSTRUCTURAL OBSERVATIONS IN CYCLICALLY DEFORMED PB-SN SOLID-SOLUTION ALLOY [J].

BETRABET, HS ;

RAMAN, V .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1988, 19 (06) :1437-1443

[5]

BETRABET HS, 1991, UNPUB J MATERIALS SC

[6] SOLIDIFICATION OF HIGHLY UNDERCOOLED SN-PB ALLOY DROPLETS [J].

CHU, MG ;

SHIOHARA, Y ;

FLEMINGS, MC .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1984, 15 (07) :1303-1310

[7] BULK UNDERCOOLING, NUCLEATION, AND MACROSEGREGATION OF PB-SN ALLOYS [J].

DEGROH, HC ;

LAXMANAN, V .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1988, 19 (11) :2651-2658

[8]

DEGROH HC, 1987, SOLIDIFICATION PROCE, V229

[9] FUNCTIONAL CYCLES AND SURFACE MOUNTING ATTACHMENT RELIABILITY. [J].

Engelmaier, W. .

Circuit World, 1985, 11 (03) :61-67

[10] FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS DURING POWER CYCLING [J].

ENGELMAIER, W .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (03) :232-237

← 1 2 3 4 →