How do carbon nanotubes fit into the semiconductor roadmap?

被引：137

作者：

Graham, AP ^{[1
]}

Duesberg, GS ^{[1
]}

Hoenlein, W ^{[1
]}

Kreupl, F ^{[1
]}

Liebau, M ^{[1
]}

Martin, R ^{[1
]}

Rajasekharan, B ^{[1
]}

Pamler, W ^{[1
]}

Seidel, R ^{[1
]}

Steinhoegl, W ^{[1
]}

Unger, E ^{[1
]}

机构：

[1] Infineon Technol AG, Corp Res, D-81739 Munich, Germany

来源：

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2005年 / 80卷 / 06期

关键词：

D O I：

10.1007/s00339-004-3151-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents an overview of the issues related to the integration of carbon nanotubes into microelectronics systems. Particular emphasis is placed on the use of carbon nanotubes as on-chip wiring (interconnects) and active devices (transistors), the two main building blocks of current semiconductor circuits. The properties of state-of-the art devices are compared in order to test the viability of replacing silicon-based components with carbon nanotubes. Further, the problems associated with the construction of nanotube-based devices are discussed.

引用

页码：1141 / 1151

页数：11

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