Inductively-coupled-plasma reactive ion etching of ZnO using BCl3-based plasmas and effect of the plasma treatment on Ti/Au ohmic contacts to ZnO

被引:35
作者
Kim, HK
Bae, JW
Kim, KK
Park, SJ
Seong, TY [1 ]
Adesida, I
机构
[1] K JIST, Dept Mat Sci & Engn, Kwangju 500712, South Korea
[2] Univ Illinois, Dept Elect & Comp Engn, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
关键词
ZnO; ICP-RIE; BCl3; plasma; ohmic contact; surface roughness;
D O I
10.1016/j.tsf.2003.09.028
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Inductively-coupled-plasma reactive ion etching (ICP-RIE) behaviour of ZnO has been investigated using BCl3-based plasmas; etch rates are studied as a function of plasma chemistry, ICP coil power and r.f. power. It is shown that compared with Cl-2/Ar, Ar and CH4/H-2-based gas mixtures, pure BCl3 gas results in high etch rates, indicating that B and BCl radicals react with ZnO and form volatile compounds such as BxOy and/or BCl-O bond. It is further shown that the specific contact resistance as low as 1.5 X 10(-5) Omega cm(2) is obtained from Ti/Au contacts on the BCl3 plasma pretreated ZnO. Based on X-ray photoelectron spectroscopy results, possible mechanisms for the BCl3-pretreated improvement of ohmic properties are described. (C) 2003 Elsevier B.V., All rights reserved.
引用
收藏
页码:90 / 94
页数:5
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