Multichip module photovoltaic miniarrays

被引：14

作者：

Ortega, PR ^{[1
]}

Bermejo, S

Castañer, LM

机构：

[1] Univ Politecn Catalunya, Semicond Devices Grp, Barcelona, Spain

[2] Univ Politecn Catalunya, Dept Ingn Elect, Escuela Tecn Super Ingenieros Telecommun, Barcelona, Spain

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2001年 / 24卷 / 02期

关键词：

back contact solar cell; crystalline silicon; flip-chip; multichip module; photovoltaic converter; photovoltaic miniarray; polyimide; telesupply;

D O I：

10.1109/6040.928751

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this work a novel concept of photovoltaic mini array assembly is described based on a flip-chip Multichip Module technology. A number of arrays composed of 15 series-connected 2 mm(2) c-Si photovoltaic cells have been fabricated; achieving a packaging density of 40 cells/cm(2), Measurements of the dark I-V characteristic confirmed that the resistive losses of the approach are small and do not degrade the electrical characteristics of the array. Nearly 0.5 mW/cm(2) delivered density power, and 7 V in open circuit conditions were typically measured under normalized solar spectrum (AM1.5 100 mW/cm(2)), and around 6.3 mW/cm(2) and 8.5 V using a 150 W commercial lamp placed at 5 cm distance from the panel.

引用

页码：169 / 174

页数：6

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