Limitations to copper grain growth in narrow trenches

被引：8

作者：

Brongersma, SH ^{[1
]}

Kerr, E ^{[1
]}

Vervoort, I ^{[1
]}

Maex, K ^{[1
]}

机构：

[1] IMEC, B-3001 Louvain, Belgium

来源：

PROCEEDINGS OF THE IEEE 2001 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2001年

关键词：

D O I：

10.1109/IITC.2001.930069

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Even though large variations are seen In transformation times for Copper blanket layers when changing layer thickness or plating current, the activation energy for secondary grain growth is always similar to 0.9 eV. The difference is attributed to variations in the number of 'nucleation sites' for secondary grains. As the number of such sites is extremely low in trenches, transformation times are very high even at elevated temperatures.

引用

页码：230 / 232

页数：3

共 6 条

[1]

BORNGERSMA SH, UNPUB J MAT RES

[2]

BRONGERSMA SH, P IITC 2000, P31

[3] Copper chip technology [J].