Design and development of high-frequency thermoacoustic engines for thermal management in microelectronics

被引：83

作者：

Symko, OG ^{[1
]}

Abdel-Rahman, E ^{[1
]}

Kwon, YS ^{[1
]}

Emmi, M ^{[1
]}

Behunin, R ^{[1
]}

机构：

[1] Univ Utah, Dept Phys, Salt Lake City, UT 84112 USA

来源：

MICROELECTRONICS JOURNAL | 2004年 / 35卷 / 02期

关键词：

heat management; thermoacoustic; miniaturization; acoustic heat pump; engine;

D O I：

10.1016/j.mejo.2003.09.017

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermoacoustic heat engines provide a practical solution to the problem of heat management in microcircuits where they can be used to pump heat or produce spot cooling of specific circuit elements. There are basically two types of thermoacoustic engines, a prime mover where heat is converted to acoustic energy, and a heat pump or cooler where sound can pump heat up a temperature gradient. Such devices are relatively simple, they can be efficient, and they are readily adaptable to microcircuit interfacing. Since this type of engines is usually operated in a resonant mode, the operating frequency determines its size. The devices presented here are pumped at frequencies ranging from 4 to 24 kHz. They have been developed for interfacing with microcircuits as heat pumps or spot coolers. Results of their performance are presented and suggestions for further improvements are discussed. (C) 2003 Elsevier Ltd. All rights reserved.

引用

页码：185 / 191

页数：7

共 19 条

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