Octahedral void defects observed in the bulk of Czochralski silicon

被引:39
作者
Ueki, T [1 ]
Itsumi, M [1 ]
Takeda, T [1 ]
机构
[1] NIPPON TELEGRAPH & TEL PUBL CORP, SYST ELECT LABS, ATSUGI, KANAGAWA 24301, JAPAN
关键词
D O I
10.1063/1.118543
中图分类号
O59 [应用物理学];
学科分类号
摘要
We found octahedral void defects in the bulk of silicon wafers by using infrared tomography. These voids are often twin type and their sizes are about 100 nm. A 2-nm-thick layer exists on the side walls of the void defects. Our analysis suggests that the 2-nm-thick layer is SiOx. It is believed that the void structure is formed as a result of agglomeration of vacancies during Si-ingot growth. (C) 1997 American Institute of Physics.
引用
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页码:1248 / 1250
页数:3
相关论文
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