Nanoporous structures prepared by an electrochemical deposition process

被引:592
作者
Shin, HC [1 ]
Dong, J [1 ]
Liu, ML [1 ]
机构
[1] Georgia Inst Technol, Sch Mat Sci & Engn, Ctr Innovat Fuel Cell & Battery Technol, Atlanta, GA 30332 USA
关键词
D O I
10.1002/adma.200305160
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Free-standing metal foam structures with nano-dendritic walls of copper and tin are fabricated by an electrochemical. deposition process. This unique structure is attributed to the concurrent generation of hydrogen bubbles with extremely fast metal deposition at high cathodic current densities. The Figure shows a typical example of the foam-like structure of tin deposits with walls composed of nano-dendritic branches.
引用
收藏
页码:1610 / +
页数:6
相关论文
共 13 条
  • [1] THE FORMATION OF PATTERNS IN NONEQUILIBRIUM GROWTH
    BENJACOB, E
    GARIK, P
    [J]. NATURE, 1990, 343 (6258) : 523 - 530
  • [2] Branched fractal patterns in non-equilibrium electrochemical deposition from oscillatory nucleation and growth
    Fleury, V
    [J]. NATURE, 1997, 390 (6656) : 145 - 148
  • [3] Electrochemically deposited tin-silver-copper ternary solder alloys
    Kim, B
    Ritzdorf, T
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (02) : C53 - C60
  • [4] Further insights on dynamic morphological transitions in quasi-two-dimensional electrodeposition
    Lopez-Salvans, MQ
    Sagues, F
    Claret, J
    Bassas, J
    [J]. PHYSICAL REVIEW E, 1997, 56 (06): : 6869 - 6876
  • [5] Kinetics of the electrodeposition of Pb⊘Sn alloys Part I.: At glassy carbon electrodes
    Petersson, I
    Ahlberg, E
    [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2000, 485 (02): : 166 - 177
  • [6] Pourbaix M., 1966, ATLAS ELECTROCHEMICA, P475
  • [7] Minimization of tin whisker formation for lead-free electronics finishing
    Schetty, R.
    [J]. Circuit World, 2001, 27 (02) : 17 - 20
  • [8] Tin whiskers studied by focused ion beam imaging and transmission electron microscopy
    Sheng, GTT
    Hu, CF
    Choi, WJ
    Tu, KN
    Bong, YY
    Nguyen, L
    [J]. JOURNAL OF APPLIED PHYSICS, 2002, 92 (01) : 64 - 69
  • [9] In situ probing of interfacial processes in the electrodeposition of copper by confocal Raman microspectroscopy
    Texier, F
    Servant, L
    Bruneel, JL
    Argoul, F
    [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1998, 446 (1-2): : 189 - 203
  • [10] Nanostructured copper filaments in electrochemical deposition
    Wang, M
    Zhong, S
    Yin, XB
    Zhu, JM
    Peng, RW
    Wang, Y
    Zhang, KQ
    Ming, NB
    [J]. PHYSICAL REVIEW LETTERS, 2001, 86 (17) : 3827 - 3830