Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

被引：39

作者：

Heschel, M ^{[1
]}

Bouwstra, S ^{[1
]}

机构：

[1] Mikroelekt Ctr, DK-2800 Lyngby, Denmark

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1998年 / 70卷 / 1-2期

关键词：

electrodepositable photoresist; feedthroughs; lithography; stacking; interconnections;

D O I：

10.1016/S0924-4247(98)00104-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new photoresist treatment is presented yielding conformal coating of three-dimensional silicon structures, including the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the conventional baking procedure with a vacuum treatment. The investigated photoresist is Shipley's Eagle 2100 ED, a negative-working electrodepositable photoresist. Additionally, the vacuum treatment allows the photoresist to be used for lift-off processes. Electrical frontside to backside interconnections suitable for solder bonding have been realized applying the latter technique. (C) 1998 Elsevier Science S.A. All rights reserved.

引用

页码：75 / 80

页数：6

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