Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

被引：135

作者：

Carlson, Andrew ^{[2
,3
]}

Kim-Lee, Hyun-Joon ^{[1
]}

Wu, Jian ^{[4
,5
]}

Elvikis, Paulius ^{[6
]}

Cheng, Huanyu ^{[4
,5
]}

Kovalsky, Anton ^{[2
,3
]}

Elgan, Steven ^{[6
]}

Yu, Qingmin ^{[4
,5
,7
]}

Ferreira, Placid M. ^{[6
]}

Huang, Yonggang ^{[4
,5
]}

Turner, Kevin T. ^{[1
]}

Rogers, John A. ^{[2
,3
]}

机构：

[1] Univ Wisconsin, Dept Mech Engn, Madison, WI 53706 USA

[2] Univ Illinois, Dept Mat Sci & Engn, Beckman Inst, Urbana, IL 61801 USA

[3] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

[4] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA

[5] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA

[6] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA

[7] Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China

来源：

APPLIED PHYSICS LETTERS | 2011年 / 98卷 / 26期

基金：

美国国家科学基金会;

关键词：

SEMITRANSPARENT; ADHESION;

D O I：

10.1063/1.3605558

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly. (C) 2011 American Institute of Physics. [doi:10.1063/1.3605558]

引用

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