Vacuum packaging technology using localized Aluminum/Silicon-to-Glass bonding

被引：21

作者：

Cheng, YT ^{[1
]}

Hsu, WT ^{[1
]}

Lin, L ^{[1
]}

Nguyen, CT ^{[1
]}

Najafi, K ^{[1
]}

机构：

[1] Univ Michigan, Ctr Wireless Integrated Microsyst, Ann Arbor, MI 48109 USA

来源：

14TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2001年

关键词：

D O I：

10.1109/MEMSYS.2001.906468

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, similar to0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive mu -resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged mu -resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A mu -resonator with Q of similar to 9600 has been vacuum encapsulated and shown to be stable after 7 weeks.

引用

页码：18 / 21

页数：2

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