An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue

被引：64

作者：

Li, Hui ^{[1
]}

Hu, Yaogang ^{[1
]}

Liu, Shengquan ^{[2
]}

Li, Yang ^{[1
]}

Liao, Xinglin ^{[1
]}

Liu, Zhixiang ^{[3
]}

机构：

[1] Chongqing Univ, Sch Elect Engn, State Key Lab Power Transmiss Equipment & Syst Se, Chongqing 400044, Peoples R China

[2] Ganzhou Power Supply Co, State Grid Jiangxi Elect Power Corp, Ganzhou 341000, Peoples R China

[3] Chongqing Kk Qianwei Wind Power Equipment Co Ltd, Chongqing 401121, Peoples R China

来源：

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2016年 / 16卷 / 04期

基金：

中国国家自然科学基金;

关键词：

wind power converter; IGBT module; thermal network model; solder desquamation; thermal resistance increment; RELIABILITY;

D O I：

10.1109/TDMR.2016.2606483

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];

摘要：

This paper presents an improved thermal network model of insulated-gate bipolar transistor (IGBT) module, which considers the effects of base-plate solder fatigue on the junction temperature of the said module used in wind power converters. First, the coupling thermal structure 3-D finite-element model of the IGBT module is established based on the structure and material parameters of the module used in the wind power converters of a doubly fed induction generator. The junction temperature of the module is investigated at different thermal desquamating degrees of the base-plate solder. Second, the thermal resistance parameters are determined at different desquamating degrees, and the improved thermal network model that considers the effects of the base-plate solder fatigue is established. Finally, the IGBT junction temperature results through the improved thermal network, and the 3-D FEM models are compared.

引用

页码：570 / 575

页数：6

共 19 条

[1]

Power Electronics Converters for Wind Turbine Systems [J].