SiC for applications in high-power electronics

被引：8

作者：

Brandt, CD ^{[1
]}

Clarke, RC

Siergiej, RR

Casady, JB

Sriram, S

Agarwal, AK

Morse, AW

机构：

[1] Northrop Grumman Sci & Technol Ctr, Pittsburgh, PA 15235 USA

[2] Northrop Grumman Elect Sensors & Syst Div, Baltimore, MD 21203 USA

来源：

SIC MATERIALS AND DEVICES | 1998年 / 52卷

关键词：

D O I：

10.1016/S0080-8784(08)62847-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

[No abstract available]

引用

页码：195 / 236

页数：42

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