Dipole model explaining high-k/metal gate field effect transistor threshold voltage tuning

被引:172
作者
Kirsch, P. D. [1 ]
Sivasubramani, P. [1 ]
Huang, J. [1 ]
Young, C. D. [1 ]
Quevedo-Lopez, M. A. [1 ]
Wen, H. C. [1 ,2 ]
Alshareef, H. [1 ]
Choi, K. [1 ]
Park, C. S. [1 ]
Freeman, K. [1 ]
Hussain, M. M. [1 ]
Bersuker, G. [1 ]
Harris, H. R. [1 ]
Majhi, P. [1 ]
Choi, R. [1 ]
Lysaght, P. [1 ]
Lee, B. H. [1 ]
Tseng, H. -H. [1 ]
Jammy, R. [1 ,3 ]
Boescke, T. S. [4 ]
Lichtenwalner, D. J. [5 ]
Jur, J. S. [5 ]
Kingon, A. I. [5 ]
机构
[1] SEMATECH, Austin, TX 78741 USA
[2] Texas Instruments Inc, Dallas, TX 75265 USA
[3] IBM Corp, Armonk, NY 10504 USA
[4] Qimonda Dresden GmbH & Co, OHG, D-01099 Dresden, Germany
[5] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
关键词
D O I
10.1063/1.2890056
中图分类号
O59 [应用物理学];
学科分类号
摘要
An interface dipole model explaining threshold voltage (V-t) tuning in HfSiON gated n-channel field effect transistors (nFETs) is proposed. V-t tuning depends on rare earth (RE) type and diffusion in Si/SiOx/HfSiON/REOx/metal gated nFETs as follows: Sr < Er < Sc+Er < La < Sc < none. This V-t ordering is very similar to the trends in dopant electronegativity (EN) (dipole charge transfer) and ionic radius (r) (dipole separation) expected for a interfacial dipole mechanism. The resulting V-t dependence on RE dopant allows distinction between a dipole model (dependent on EN and r) and an oxygen vacancy model (dependent on valence). (c) 2008 American Institute of Physics.
引用
收藏
页数:3
相关论文
共 17 条
[1]   Work function engineering using lanthanum oxide interfacial layers [J].
Alshareef, H. N. ;
Quevedo-Lopez, M. ;
Wen, H. C. ;
Harris, R. ;
Kirsch, P. ;
Majhi, P. ;
Lee, B. H. ;
Jammy, R. ;
Lichtenwalner, D. J. ;
Jur, J. S. ;
Kingon, A. I. .
APPLIED PHYSICS LETTERS, 2006, 89 (23)
[2]   A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect layers, low-k ILD and 0.57 μm2 SRAM cell [J].
Bai, P ;
Auth, C ;
Balakrishnan, S ;
Bost, M ;
Brain, R ;
Chikarmane, V ;
Heussner, R ;
Hussein, M ;
Hwang, J ;
Ingerly, D ;
James, R ;
Jeong, J ;
Kenyon, C ;
Lee, E ;
Lee, SH ;
Lindert, N ;
Liu, M ;
Ma, Z ;
Marieb, T ;
Murthy, A ;
Nagisetty, R ;
Natarajan, S ;
Neirynck, J ;
Ott, A ;
Parker, C ;
Sebastian, J ;
Shaheed, R ;
Sivakurnar, S ;
Steigerwald, J ;
Tyagi, S ;
Weber, C ;
Woolery, B ;
Yeoh, A ;
Zhang, K ;
Bohr, M .
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, :657-660
[3]   High-quality aluminum oxide gate dielectrics by ultra-high-vacuum reactive atomic-beam deposition [J].
Guha, S ;
Cartier, E ;
Bojarczuk, NA ;
Bruley, J ;
Gignac, L ;
Karasinski, J .
JOURNAL OF APPLIED PHYSICS, 2001, 90 (01) :512-514
[4]   Band-engineered low PMOS VT with high-K/metal gates featured in a dual channel CMOS integration scheme [J].
Harris, H. Rusty ;
Kalra, Pankaj ;
Majhi, Prashant ;
Hussain, Muhammed ;
Kelly, David ;
Oh, Jungwoo ;
He, Dawei ;
Smith, Casey ;
Barnett, Joel ;
Kirsch, Paul D. ;
Gebara, Gabriel ;
Jur, Jess ;
Lichtenwalner, Daniel ;
Lubow, Abigail ;
Ma, T. P. ;
Sung, Guangyu ;
Thompson, Scott ;
Lee, Byoung Hun ;
Tseng, Hsing Huang ;
Jammy, Raj .
2007 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2007, :154-+
[5]   Nucleation and growth study of atomic layer deposited HfO2 gate dielectrics resulting in improved scaling and electron mobility -: art. no. 023508 [J].
Kirsch, PD ;
Quevedo-Lopez, MA ;
Li, HJ ;
Senzaki, Y ;
Peterson, JJ ;
Song, SC ;
Krishnan, SA ;
Moumen, N ;
Barnett, J ;
Bersuker, G ;
Hung, PY ;
Lee, BH ;
Lafford, T ;
Wang, Q ;
Gay, D ;
Ekerdt, JG .
JOURNAL OF APPLIED PHYSICS, 2006, 99 (02) :1-8
[6]  
KRISCH PD, 2006, INT EL DEV M, P629
[7]  
KRISCH PD, 2006, APPL PHYS LETT, V89, P1
[8]   Lanthanum silicate gate dielectric stacks with subnanometer equivalent oxide thickness utilizing an interfacial silica consumption reaction [J].
Lichtenwalner, DJ ;
Jur, JS ;
Kingon, AI ;
Agustin, MP ;
Yang, Y ;
Stemmer, S ;
Goncharova, LV ;
Gustafsson, T ;
Garfunkel, E .
JOURNAL OF APPLIED PHYSICS, 2005, 98 (02)
[9]  
Narayanan V., 2006, VLSI, P224
[10]   Interfacial reactions between thin rare-earth-metal oxide films and Si substrates [J].
Ono, H ;
Katsumata, T .
APPLIED PHYSICS LETTERS, 2001, 78 (13) :1832-1834