We have developed a 2.05 um(2) full-CMOS ultra-low power SRAM Cell, which is probably the world-smallest, using 0.15um generation single gate CMOS technology. The technology includes i) 0.15um direct contact (to active region and gate poly) implemented by phase shift mask (PSM) and the shrinkage of contact by photo-resist (PR) reflow, ii) W-damascened local interconnection with 0.30um pitch, iii)careful optimization of 0.17um gate length buried channel (BC) pMOS to minimize the leakage current, while excludes self-aligned contact, Co-salicide, and rapid thermal annealing (RTA).