Back-gate bias enhanced band-to-band tunneling leakage in scaled MOSFET's

被引:24
作者
Chen, MJ [1 ]
Huang, HT
Hou, CS
Yang, KN
机构
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
[2] Taiwan Semicond Mfg Co, Log Technol R&D Dept, Hsinchu 300, Taiwan
关键词
D O I
10.1109/55.663538
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The drain leakage current in MOSFET's in the present standard process is separated into three distinct components: the subthreshold conduction, the surface band-to-band tunneling (BTBT), and the bulk BTBT, Each of the three shows different dependencies on hack-gate bias, As a result, the hulk BTBT, increasing exponentially with increasing the magnitude of back-gate reverse bias, promptly dominates the drain leakage, Additional experiment highlights the effect of the increased hulk dopant concentrations as in next-generation scaled MOSFET's on the bulk BTBT, This sets the hulk BTBT a significant constraint to the low-voltage. low-power, high-density circuits employing the back-gate reverse bias, In the work, the measured drain leakage of interest is successfully reproduced by two-dimensional (2-D) device simulation.
引用
收藏
页码:134 / 136
页数:3
相关论文
共 6 条
[1]  
Chan TY, 1987, IEDM TECH DIG, P718
[2]  
CHANG C, 1987, IEDM TECH DIG, P714
[3]   SUB-BREAKDOWN DRAIN LEAKAGE CURRENT IN MOSFET [J].
CHEN, J ;
CHAN, TY ;
CHEN, IC ;
KO, PK ;
HU, C .
IEEE ELECTRON DEVICE LETTERS, 1987, 8 (11) :515-517
[4]   EFFECT OF BACK-GATE BIAS ON TUNNELING LEAKAGE IN A GATED P+-N DIODE [J].
CHEN, MJ .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (05) :249-251
[5]   SCALING OF MOS TECHNOLOGY TO SUBMICROMETER FEATURE SIZES [J].
MEAD, CA .
JOURNAL OF VLSI SIGNAL PROCESSING, 1994, 8 (01) :9-25
[6]   CMOS scaling into the nanometer regime [J].
Taur, Y ;
Buchanan, DA ;
Chen, W ;
Frank, DJ ;
Ismail, KE ;
Lo, SH ;
SaiHalasz, GA ;
Viswanathan, RG ;
Wann, HJC ;
Wind, SJ ;
Wong, HS .
PROCEEDINGS OF THE IEEE, 1997, 85 (04) :486-504