Tin electrodeposition on carbon electrodes.: From nuclei to microcrystallites

被引:44
作者
Gómez, E [1 ]
Guaus, E [1 ]
Sanz, F [1 ]
Vallés, E [1 ]
机构
[1] Univ Barcelona, Lab Ciencia & Tecnol Electroquim Mat, Dept Quim Fis, E-08028 Barcelona, Spain
来源
JOURNAL OF ELECTROANALYTICAL CHEMISTRY | 1999年 / 465卷 / 01期
关键词
tin; electrodeposition; scanning electron microscopy; atomic force microscopy; nucleation; crystallites;
D O I
10.1016/S0022-0728(99)00055-8
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Tin electrodeposition from sulfuric acid solutions has been studied on two carbon substrates combining the use of electrochemical and morphological (nano- and micrometric) techniques. On a vitreous carbon substrate, the analysis of the electrochemical results reveals that the tin electrodeposition process occurs through an instantaneous nucleation and three-dimensional growth limited by diffusion. Well defined tetragonal microcrystallites of similar size have been observed when the deposit was obtained at low rates. The formation of tetragonal microcrystallites has also been observed on oriented graphite also favoured by the slow growth of the tin deposit. The AFM images indicate that the crystallites have as predecessors three-dimensional poorly-structured overlapped aggregates formed as a result of surface diffusion of the aggregates formed previously. Some of them evolve to incipient flat crystallites that later grow preferentially in the z-direction under diffusion control of the Sn(II) species in solution. The easier deposition of tin on tin as opposed to a carbon substrate and the low-energetic barrier for the reorganization of tin atoms on the crystalline lattice will explain the well defined tetragonal shape of the microcrystallites. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:63 / 71
页数:9
相关论文
共 36 条
[21]  
McCreery R.L., 1991, Electroanal. Chem, V17, P221
[22]   STM OBSERVATIONS OF THE INITIAL-STAGES OF COPPER DEPOSITION ON GOLD SINGLE-CRYSTAL ELECTRODES [J].
NICHOLS, RJ ;
KOLB, DM ;
BEHM, RJ .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1991, 313 (1-2) :109-119
[23]   AN INSITU SCANNING TUNNELING MICROSCOPY STUDY OF BULK COPPER DEPOSITION AND THE INFLUENCE OF AN ORGANIC ADDITIVE [J].
NICHOLS, RJ ;
BECKMANN, W ;
MEYER, H ;
BATINA, N ;
KOLB, DM .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1992, 330 (1-2) :381-394
[24]  
OTHMER K, 1997, ENCY CHEM TECHNOLOGY, V24, P105
[25]   NANOSCALE STUDIES OF AG ELECTRODEPOSITION OM HOPG(0001) [J].
POTZSCHKE, RT ;
GERVASI, CA ;
VINZELBERG, S ;
STAIKOV, G ;
LORENZ, WJ .
ELECTROCHIMICA ACTA, 1995, 40 (10) :1469-1474
[26]   3-DIMENSIONAL NUCLEATION WITH DIFFUSION CONTROLLED GROWTH .1. NUMBER DENSITY OF ACTIVE-SITES AND NUCLEATION RATES PER SITE [J].
SCHARIFKER, BR ;
MOSTANY, J .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1984, 177 (1-2) :13-23
[27]   TUNNELING MICROSCOPY IN AN ELECTROCHEMICAL-CELL - IMAGES OF AG-PLATING [J].
SONNENFELD, R ;
SCHARDT, BC .
APPLIED PHYSICS LETTERS, 1986, 49 (18) :1172-1174
[28]   ELECTROCHEMICAL REACTIONS OF TIN IN AQUEOUS ELECTROLYTIC SOLUTIONS [J].
STIRRUP, BN ;
HAMPSON, NA .
SURFACE TECHNOLOGY, 1977, 5 (06) :429-462
[29]  
TABOR D, 1991, GASES LIQUIDS SOLIDS, P162
[30]  
VALLES E, 1993, J APPL ELECTROCHEM, V23, P508