MEMS capacitive accelerometers

被引:15
作者
Biswas, Karabi [1 ]
Sen, Siddhartha
Dutta, Pranab Kumar
机构
[1] Jadavpur Univ, Dept Instrumentat & Elect Engn, Kolkata 700098, India
[2] Indian Inst Technol, Dept Elect Engn, Kharagpur 721302, W Bengal, India
关键词
MEMS capacitive accelerometer; structural design; signal conditioning circuit; fabrication; noise analysis; optimization; simulation tools; packaging;
D O I
10.1166/sl.2007.201
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
In the present paper, several aspects of the design of MEMS capacitance accelerometers have been reviewed. In the first part of this review; the mechanical sensing element is considered and detailed survey has been carried out on the different structures, their specifications and the different fabrication technology used by the researchers, the simulation tools used for its modeling and numerical analysis, the work done to optimize the design parameters. The second part is on the signal conditioning circuit. Main emphasis is given on the different design of the circuit, its simulation, fabrication, and integration with the mechanical sensing element. Survey has been also conducted on the packaging issues and noise analysis of the complete accelerometer system.
引用
收藏
页码:471 / 484
页数:14
相关论文
共 155 条
[1]  
ALLEN JJ, 1998, IEE AES SYS MAGAZINE
[2]  
ALLEN PE, 1992, CMOS ANALOG CIRCUIT
[3]   A high resolution, stictionless, CMOS compatible SOI accelerometer with a low noise, low power, 0.25μm CMOS interface [J].
Amini, BV ;
Pourkamah, S ;
Ayazi, F .
MEMS 2004: 17TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2004, :572-575
[4]   A COMPARISON OF SQUEEZE-FILM THEORY WITH MEASUREMENTS ON A MICROSTRUCTURE [J].
ANDREWS, M ;
HARRIS, I ;
TURNER, G .
SENSORS AND ACTUATORS A-PHYSICAL, 1993, 36 (01) :79-87
[5]  
[Anonymous], 1990, PLASTIC PACKAGING MI
[6]  
[Anonymous], 12 INT C TRANSD SOL
[7]  
BANDWAR N, 2005, THESIS INDIAN I TECH
[8]  
Baxter L.K., 1997, CAPACITIVE SENSORS D
[9]  
BELIVEAU A, 1999, IEEE DESIGN TEST COM
[10]   Low-noise MEMS vibration sensor for geophysical applications [J].
Bernstein, J ;
Miller, R ;
Kelley, W ;
Ward, P .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1999, 8 (04) :433-438