Fabrication and characterization of microinductors for distributed power converters

被引:37
作者
Brandon, EJ [1 ]
Wesseling, E [1 ]
White, V [1 ]
Ramsey, C [1 ]
Del Castillo, L [1 ]
Lieneweg, U [1 ]
机构
[1] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA
关键词
distributed power electronics; integrated passive components; microinductors;
D O I
10.1109/TMAG.2003.812705
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Inductors play a key role in dc-dc converters, but few options exist for implementing on-chip inductors for highly miniaturized, monolithic power converters. Microinductors constructed by standard microelectronic fabrication techniques with magnetic films as the core material have been investigated during the past 20 years with mixed results. A 13-mm(2) microinductor based on a spiral geometry and having L = 3.2 muH and Q = 1.3 at 1 MHz is reported here. Key issues regarding microinductor design and performance are discussed.
引用
收藏
页码:2049 / 2056
页数:8
相关论文
共 26 条
[1]   Micromachined planar inductors on silicon wafers for MEMS applications [J].
Ahn, CH ;
Allen, MG .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 1998, 45 (06) :866-876
[2]  
BRUNET M, 2001, P IEEE APPL POW EL C, V2, P1189
[3]   Design of microfabricated inductors [J].
Daniel, L ;
Sullivan, CR ;
Sanders, SR .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 1999, 14 (04) :709-723
[4]   DESIGN OF PLANAR RECTANGULAR MICROELECTRONIC INDUCTORS [J].
GREENHOUSE, HM .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02) :101-109
[5]   Calculation of self- and mutual impedances in planar sandwich inductors [J].
Hurley, WG ;
Duffy, MC .
IEEE TRANSACTIONS ON MAGNETICS, 1997, 33 (03) :2282-2290
[7]   HIGH-FREQUENCY HIGH-DENSITY CONVERTERS FOR DISTRIBUTED POWER-SUPPLY SYSTEMS [J].
KASSAKIAN, JG ;
SCHLECHT, MF .
PROCEEDINGS OF THE IEEE, 1988, 76 (04) :362-376
[8]  
Korenivski V, 1997, J APPL PHYS, V82, P5247, DOI 10.1063/1.366391
[9]  
Kuhn WB, 1999, MICROWAVE J, V42, P66
[10]  
LIAKOPOULOS TM, 2000, P EL SOC MAGN MAT 6, V2000, P580