Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films

被引:49
作者
Zhao, JH
Malik, I
Ryan, T
Ogawa, ET
Ho, PS
Shih, WY
McKerrow, AJ
Taylor, KJ
机构
[1] Univ Texas, Mat Sci Lab Interconnect & Packaging, Austin, TX 78712 USA
[2] Texas Instruments Inc, Semicond Proc & Device Ctr, Dallas, TX 75243 USA
关键词
D O I
10.1063/1.123417
中图分类号
O59 [应用物理学];
学科分类号
摘要
This letter describes measurement of the biaxial modulus, coefficient of thermal expansion (CTE), and moisture uptake characteristics of hydrogen silsesquioxane (HSQ) thin films. The biaxial modulus and CTE were determined using a bending beam method, and moisture uptake was studied using a quartz crystal microbalance method. The biaxial modulus and CTE of a 0.5 mu m HSQ film were measured on Si and Ge substrates and found to be 7.07 GPa and 20.5 ppm/degrees C, respectively. The value determined for the diffusion constant of water in a 0.7-mu m-thick HSQ films is 3.61 X 10(-10) cm(2)/s at room temperature. (C) 1999 American Institute of Physics. [S0003-6951(99)02907-1].
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收藏
页码:944 / 946
页数:3
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