Physics-based CAD models for the analysis of vias in parallel-plate environments

被引：48

作者：

Abhari, R ^{[1
]}

Eleftheriades, GV ^{[1
]}

van Deventer-Perkins, E ^{[1
]}

机构：

[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2001年 / 49卷 / 10期

基金：

加拿大自然科学与工程研究理事会;

关键词：

decoupling capacitors; ground bounce; package resonances; parallel-plate noise; radial transmission lines; switching noise; vias;

D O I：

10.1109/22.954773

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, physics-based computer-aided-design (CAD) models for through and buried vias in parallel-plate environments are presented based on radial transmission-line theory. The crosstalk power transferred by the TEM parallel-plate mode between vias is characterized, and extended to the treatment of vias in finite substrates by means of image theory. The presented CAD models can be combined with lumped and distributed circuit elements, as well as linear and nonlinear devices, providing an accurate and fast procedure for the global modeling of high-speed electronic circuits. The corresponding simulation time for representative single or multiple via configurations has been drastically reduced compared to full-wave simulations while maintaining comparable accuracy.

引用

页码：1697 / 1707

页数：11

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