Modeling of interconnections and isolation within a multilayered ball grid array package

被引：30

作者：

Ito, R ^{[1
]}

Jackson, RW

Hongsmatip, T

机构：

[1] Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA

[2] MA COM, Lowell, MA 01853 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1999年 / 47卷 / 09期

关键词：

BGA; electrical isolation; microwave packaging; multichip module; package isolation; package model;

D O I：

10.1109/22.788517

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-element circuit model is developed for each layer/interconnection. A simple numerical method tier computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in EGA packages at microwave frequencies.

引用

页码：1819 / 1825

页数：7

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