Modeling millimeter-wave IC behavior for flipped-chip mounting schemes

被引：13

作者：

Jackson, RW

Ito, R

机构：

[1] Department of Electrical and Computer Engineering, University of Massachusetts, Amherst

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1997年 / 45卷 / 10期

关键词：

flip chip; microwave packaging; MMIC packaging;

D O I：

10.1109/22.641791

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A circuit topology is presented for modeling flipped-chip-mounted monolithic microwave integrated circuits (MMIC's) at microwave frequencies, The proposed topology especially models the loss of isolation due to the flipped-chip structure, Both coplanar and microstrip flipped chips are circuit modeled and their results compared to full numerical simulations and to scale-model measurements, Both measurements and numerical modeling show resonances in the millimeter-wave range.

引用

页码：1919 / 1925

页数：7

共 5 条

[1]

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[2]

Ghouz HHM, 1996, IEEE MTT-S, P1827, DOI 10.1109/MWSYM.1996.512300

[3]

JIN H, 1994, IEEE MTT-S, P1711, DOI 10.1109/MWSYM.1994.335111

[4] THE EVOLUTION OF PACKAGES FOR MONOLITHIC MICROWAVE AND MILLIMETER-WAVE CIRCUITS [J].