Effect of tensile strain on adatom diffusion on Cu(111) surface

被引：6

作者：

Wang, YX ^{[1
]}

Pan, ZY ^{[1
]}

Li, ZJ ^{[1
]}

Wei, Q ^{[1
]}

Zang, LK ^{[1
]}

Zhang, ZX ^{[1
]}

机构：

[1] Fudan Univ, Inst Modern Phys, Shanghai 200433, Peoples R China

来源：

SURFACE SCIENCE | 2003年 / 545卷 / 1-2期

关键词：

molecular dynamics; copper; adatoms; surface diffusion; surface stress;

D O I：

10.1016/j.susc.2003.09.005

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The dependence of the adatom diffusion on the strained (1 1 1) surface of Cu metal was investigated using molecular dynamics simulation. It is found that the diffusion coefficient of the Cu adatom on Cu surface decreases with increasing tensile strain at different temperatures where we studied. On the strained surface, the diffusion coefficient still exhibits approximately Arrhenius behavior. The main diffusion is the hopping diffusion. While, with the temperature or the tensile strain raised further, the exchange diffusion appears. And its frequency will increase with these values. (C) 2003 Elsevier B.V. All rights reserved.

引用

页码：137 / 142

页数：6

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