Reliability of gate oxide grown on nitrogen-implanted Si substrates

被引:20
作者
Lin, C
Chou, AI
Choudhury, P
Lee, JC
Kumar, K
Doyle, B
Soleimani, HR
机构
[1] LSI LOG CORP,SANTA CLARA,CA 95054
[2] INTEL CORP,SANTA CLARA,CA 95052
[3] DIGITAL EQUIPMENT CORP,ULSI OPERAT GRP,HUDSON,MA 01749
关键词
D O I
10.1063/1.117194
中图分类号
O59 [应用物理学];
学科分类号
摘要
Direct nitrogen implant into Si substrate prior to gate oxidation has been proposed to grow multiple gate oxide thicknesses on a single wafer. In this letter, we have studied the reliability of gate oxide grown on nitrogen-implanted Si substrate. The effects of implant doses, sacrificial oxide thicknesses, and gate oxide thicknesses on gate oxide reliability have been investigated. It was found that there is a tradeoff between oxide thickness control and gate oxide reliability. (C) 1996 American Institute of Physics.
引用
收藏
页码:3701 / 3703
页数:3
相关论文
共 7 条
  • [1] DEPAS M, 1994, S VLSI TECHN, P23
  • [2] SIMULTANEOUS GROWTH OF DIFFERENT THICKNESS GATE OXIDES IN SILICON CMOS PROCESSING
    DOYLE, B
    SOLEIMANI, HR
    PHILIPOSSIAN, A
    [J]. IEEE ELECTRON DEVICE LETTERS, 1995, 16 (07) : 301 - 302
  • [3] Hwang H., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P421, DOI 10.1109/IEDM.1990.237142
  • [4] Jaraiz M, 1996, APPL PHYS LETT, V68, P409, DOI 10.1063/1.116701
  • [5] 25 angstrom gate oxide without boron penetration for 0.25 and 0.3-mu m PMOSFETs
    Liu, CT
    Ma, Y
    Cheung, KP
    Chang, CP
    Fritzinger, L
    Becerro, J
    Luftman, H
    Vaidya, HM
    Colonell, JI
    Kamgar, A
    Minor, JF
    Murray, RG
    Lai, WYC
    Pai, CS
    Hillenius, SJ
    [J]. 1996 SYMPOSIUM ON VLSI TECHNOLOGY: DIGEST OF TECHNICAL PAPERS, 1996, : 18 - 19
  • [6] Moazzami R., 1992, International Electron Devices Meeting 1992. Technical Digest (Cat. No.92CH3211-0), P139, DOI 10.1109/IEDM.1992.307327
  • [7] FORMATION OF ULTRATHIN NITRIDED SIO2 OXIDES BY DIRECT NITROGEN IMPLANTATION INTO SILICON
    SOLEIMANI, HR
    DOYLE, BS
    PHILIPOSSIAN, A
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (08) : L132 - L134