Ultrashort-pulse laser machining of dielectric materials

被引：444

作者：

Perry, MD ^{[1
]}

Stuart, BC ^{[1
]}

Banks, PS ^{[1
]}

Feit, MD ^{[1
]}

Yanovsky, V ^{[1
]}

Rubenchik, AM ^{[1
]}

机构：

[1] Univ Calif Lawrence Livermore Natl Lab, Livermore, CA 94550 USA

来源：

JOURNAL OF APPLIED PHYSICS | 1999年 / 85卷 / 09期

关键词：

D O I：

10.1063/1.370197

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

There is a strong deviation from the usual tau(1/2) scaling of laser damage fluence for pulses below 10 ps in dielectric materials. This behavior is a result of the transition from a thermally dominated damage mechanism to one dominated by plasma formation on a time scale too short for significant energy transfer to the lattice. This new mechanism of damage (material removal) is accompanied by a qualitative change in the morphology of the interaction site and essentially no collateral damage. High precision machining of all dielectrics (oxides, fluorides, explosives, teeth, glasses, ceramics, SiC, etc.) with no thermal shock or distortion of the remaining material by this mechanism is described. (C) 1999 American Institute of Physics. [S0021-8979(99)01109-3].

引用

页码：6803 / 6810

页数：8

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