Wet thermal oxidation of GaN

被引:65
作者
Readinger, ED [1 ]
Wolter, SD
Waltemyer, DL
Delucca, JM
Mohney, SE
Prenitzer, BI
Giannuzzi, LA
Molnar, RJ
机构
[1] Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA
[2] Univ Cent Florida, Dept Mech Mat & Aerosp Engn, Orlando, FL 32816 USA
[3] MIT, Lincoln Lab, Lexington, MA 02173 USA
基金
美国国家科学基金会;
关键词
GaN; thermal oxidation;
D O I
10.1007/s11664-999-0024-z
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal oxidation of GaN was conducted at 700-900 degrees C with O-2, N-2, and Ar as carrier gases for 525-630 Torr of H2O vapor. Upon oxidation of both GaN powders and n-GaN epilayers, the monoclinic beta-Ga2O3 phase was identified using glancing angle x-ray diffraction. The chemical composition of the oxide was verified using x-ray photoelectron spectroscopy. In experiments conducted using GaN powder, the oxide grew most rapidly when O-2 was the carrier gas for H2O. The same result was obtained on n-type GaN epilayers. Furthermore, the thickness of the oxide grown in H2O with O-2 as the carrier gas was found to be proportional to the oxidation time at all temperatures studied, and an activation energy of 210+/-10 kJ/mol was obtained. Scanning electron microscopy revealed a smoother surface after wet oxidation than was reported previously for dry oxidation. However, cross-sectional transmission electron microscopy revealed that the wet oxide/GaN interface was irregular and non-ideal for device fabrication, even more so than the dry oxide/GaN interface. This observation was consistent with poor electrical properties.
引用
收藏
页码:257 / 260
页数:4
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