共 13 条
[1]
Structural and electrical investigations of silicon wafer bonding interfaces
[J].
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY,
1996, 42 (1-3)
:164-167
[3]
ELECTRON-DIFFRACTION AND MICROSCOPY STUDIES OF THE STRUCTURE OF GRAIN-BOUNDARIES IN SILICON
[J].
PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES,
1981, 43 (02)
:441-467
[5]
Ultra thin silicon films directly bonded onto silicon wafers
[J].
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY,
2000, 73 (1-3)
:42-46
[6]
GHANDI SK, 1983, VLSI FABRICATION PRI, P377
[7]
HIGASHI GS, 1993, HDB SEMICONDUCTOR WA, P433
[8]
SANGWAL K, 1987, ETCHING CRYSTALS
[9]
DISLOCATION SUB-BOUNDARY ARRAYS IN ORIENTED THIN-FILM BICRYSTALS OF GOLD
[J].
PHILOSOPHICAL MAGAZINE,
1969, 20 (165)
:511-&
[10]
EXPERIMENTAL AND THEORETICAL-STUDIES OF THE DISLOCATION-STRUCTURE OF NIO-PT INTERFACES
[J].
ACTA METALLURGICA ET MATERIALIA,
1990, 38 (09)
:1653-1667