Structure and properties of silicon oxide films deposited in a dual microwave-rf plasma reactor

被引:23
作者
Benissad, N
Aumaille, K
Granier, A
Goullet, A
机构
[1] Inst Mat Jean Rouxel, Lab Plasmas & Couches Minces, F-44322 Nantes 03, France
[2] Univ Paris Sud, Phys Gaz & Plasmas Lab, F-91405 Orsay, France
关键词
silicon oxide; plasma processing and deposition; infrared spectroscopy; ellipsometry;
D O I
10.1016/S0040-6090(00)01870-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The characterisation of SiOx thin films deposited from hexamethyldisiloxane in a microwave plasma reactor showed they were carbon containing and porous. With the aim of improving the film quality, the substrate holder was biased with the use of a 13.56-MHz radio-frequency power supply. Results on chemical structure, deposition rate and optical emission spectroscopy are reported. The rf-induced negative bias voltage affected both gas phase reactions and film composition. Moreover, it induced change in the deposition rate. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:230 / 235
页数:6
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