Young's modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing

被引:22
作者
Macionczyk, F [1 ]
Bruckner, W [1 ]
Pitschte, W [1 ]
Reiss, G [1 ]
机构
[1] Inst Solid State & Mat Res Dresden, D-01171 Dresden, Germany
关键词
D O I
10.1557/JMR.1998.0390
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Force-strain curves were measured for 1.0 mu m and 1.5 mu m thick Cu0.57Ni0.42Mn0.01 films on 8 mu m thick polyimide foils by tensile testing. By separating the force working on the polyimide foil from that working on the metal-polyimide compound, stress-strain curves for the CuNi(Mn) films were obtained. Young's modulus and tensile strength were determined for as-deposited and annealed [350 degrees C, 1 h, N-2/H-2 (5 vol %) atmosphere] films by this method. Crack propagation starts at the end of the elastic region at 0.2 to 0.7% strain, depending on the film thickness and the thermal treatment. The cracking behavior is described by a steady-state approximation.
引用
收藏
页码:2852 / 2858
页数:7
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